Chip Packaging

Chip Packaging

Or in the Indonesian language is the chip packaging. Is the outer layer of the physical building blocks of each memory chip. Most often used, in the TSOP DDR memory modules (Narrow Tiny Outline Package). On RDRAM & DDR2 using CSP (Chip Scale Package). A quantity of the chip to memory modules prior to make use of DIP (Dual In-Line Package) & SOJ (Tiny Outline J-lead).

DIP (Dual In-Line Package)

This type of memory chip used when memory is installed directly on the motherboard PCB. DIP included in the section of through-hole parts, which can be mounted on the PCB through holes are obtainable for the legs / pins. Type of DRAM chips can be soldered or attached with the socket. SOJ (Tiny Outline J-Lead) Chip DRAM SOJ type, called demikan because it's a pin formed like huruh AJA. SOJ included in surfacemount part, meaning that this part is installed on the side surface on the PCB.

TSOP (Narrow Tiny Outline Package)

Included in surfacemount part. His name is in accordance with the shape & physical size are much thinner & smaller than a SOJ.

CSP (Chip Scale Package)
If the DIP, SOJ & TSOP using the legs / pins to connect it to the board, CSP is no longer using a PIN. Connections using a BGA (Ball Grid Array) contained at the bottom of the part. DRAM chip parts are put in to use in the RDRAM (Rambus DRAM) & DDR.